Authorized Installation and Service Partner

Hakuto 630/6630NP

Next Generation Auto Film Laminator

Advanced circuit designs are requiring finer circuit features and more variations in substrate materials, copper types and thicknesses challenging all aspects of the PCB imaging process. Precise and uniform application and adhesion of the dry film photoresist to the laminate materials is required to ensure high yields. The technology supporting this lamination process has been relatively unchanged since its inception over 40 years ago.

Printed circuit board dry film resist is applied by using carefully controlled heated rubber rolls under pressure. Historic and most current lamination technology applies pressure to the end shafts of heated rubber rollers. This mechanical design (below) has an inherent weakness in the fact that it produces uneven pressure across the surface of the PCB. This results in lower pressure and lower heat transfer toward the center of the board. This uneven pressure phenomenon across the surface of the PCB can cause faulty image transfer resulting in open circuit defects on the final etched layer further resulting in lower yields. The industry has tried a variety of modifications to correct this deficiency including heavy duty rolls, cantilevered pressure mechanisms, and wet lamination.

Hakuto has solved this uneven pressure issue by redesigning the heating and pressure distribution rolls to ensure even pressure and even temperature across the surface of the PCB panel enabling consistent fine line imaging performance and higher yields.

The next generation Hakuto dry film laminator also includes a host of new features and options that improve productivity, quality, and yield.

Features

  • Simple and Fast Lamination Roll Exchange – change durometer of rolls in 5 minutes or less
  • Available film loading cartridges – load dry film offline and reload laminator quickly
  • Ultrathin and thick panel transport options available
  • New Pressure and Temperature Uniformity Module
  • Auto centering device for precise placement of dry film on the panel
  • Complete Enclosure for Clean Operation – HEPA filtering as an option
  • ECO Take-up Roll for Easy Mylar Removal
  • Touch panel PLC Control
  • Easy machine accessibility for servicing and maintenance

Laminator Features and Options

  Mach 630NP Mach 660NP
Easy Lamination Roll Exchange S S
Easy Maintenance S S
EVEN Pressure Uniformity Module S S
EVEN Temperature Uniformity Module S S
Full Enclosure for Clean Operation S S
Touch Screen PLC Control S S
ECO Take-up Roll for Easy Mylar Removal S S
Cartridge Film Loading System O S
Exit Panel Temperature Monitoring O S
Dry Film Usage and End Warning Indicators O S
Ultra Thin Transport O O
Thick PCB Transport O O
HEPA filter with Ionizer O O
Mach Prolog Software (Custom Request) O O

S = Standard Feature | O = Optional Feature